摘 要近些年来，设备在硬件方面取得了很大的创新和发展，电子产品的中央处理器也逐渐进入了超频时代同时电子封装技术也发生了很大的改变。电子封装经历了DIP、TSOP、BGA、CSP这几个阶段。为了让计算机全面的发展不仅要在芯片方面取得创新同时也要让电脑系统的发展相得益彰。对计算机而言，内存是最重要的一部分。全面发展计算机的决定因素是内存。随着技术的发展，近些年来内存技术逐渐日益发展。在这个过程中，对内存技术的要求以及使用效率都有很大的要求，因此在内存技术领域，这也是发展它的最重要的原因，但是最影响内存技术换句话说影响设备可靠性以及使用寿命的最重要的因素是封装技术。封装的形式从大体积的针脚插装封装技术到近些年的小型化的CSP封装技术。它们不仅从材料，而且在它的性能、可靠性、使用寿命等等方面都有了很大的改善。因此内存的性能主要取决于封装的特性。封装从基础的DIP过度到CSP这意味着封装技术快速 的发展以至于设备的内存逐渐向高频、高速这个要求发展 。随着CSP技术的出现解决了内存的高性能、高频率、容量、散热等等问题同时CSP技术弥补TSOP、BGA技术的不足以及它也成为封装技术发展的主要趋势。76446
本文主要是通过ANSYS软件建立CSP器件结构的三维模型，进行模拟。通过改变焊球的直径和高度以及芯片和基板的尺寸，观察它们应力、应变的相对改变。根据对应的曲线，选择最佳的焊球直径以及芯片、基板尺寸来提高器件结构的使用寿命从而进行结构优化。从分析的结果可以得到：焊点应变的最大值出现在芯片和焊点交接的地方，出现以上现象的原因是它们交接的地方有不均匀等效应力。影响封装可靠性的因素有焊点的高度、直径以及芯片的厚度。
该论文有图36幅，表3个，参考文献29篇。
毕业论文关键字：有限元分析 三维模型 使用寿命 应力
CSP device structure optimization design
Abstract In recent years，equipment has made great innovation and development in hardware, the central processor of electronic products has gradually entered the era of overclocking at the same time the electronic packaging technology has changed a lot。 Electronic packaging has experienced DIP, TSOP, BGA, CSP these stages。In order to make the computer comprehensive development not only in the chip to achieve innovation but also to the development of computer systems complement each other。 On the computer，memory is the most important part of。 The decisive factor for the overall development of the computer is memory。 With the development of Technology, in recent years, the gradual development of memory technology innovation。 In this process, the requirements of the memory technology and the use of efficiency has a great demand。 So in the area of memory technology，this is also the most important reason for the development of it。 But the most important factor affecting the reliability and service life of the device is the packaging technology。 Packaging technology in the form of a large volume of pin plug-in package technology in recent years, the miniaturization of CSP packaging technology。 They not only from the material, but also in its performance, reliability, service life and so on have been greatly improved。 Therefore, the performance of memory is mainly determined by the characteristics of the package。 Package from the base of the DIP over to CSP this means that the rapid development of this packaging technology so that the memory of the device is gradually to the high frequency, high speed development of this requirement。 With the emergence of CSP technology to solve the memory of high performance, high frequency, capacity, heat and so on。 CSP technology to make up for the lack of BGA, TSOP technology at the same time it has become the main trend of the development of packaging technology。 ANSYS的CSP器件结构优化设计:http://www.youerw.com/jixie/lunwen_87695.html