[24]  赵璋，童志义。 3D-TSV 技术—延续摩尔定律的有效通途[J]。  电子工业专业设备，2011，

[25]   曾小亮，孙蓉，于淑会，等。电子封装基板材料研究进展与发展趋势[J]。  集成技术，2014，3(6)：76-83。

[26] Anders D ,Hersch C ,Weinberg K,Computational modeling of phase separationand论文网

coarsening in solder alloy s[J]。International Journal of Solids and Structures,2012,49(1 3);1577-1572。

[27] Wang G Z,Cheng Z N,Becker K。Applying Anand model to represent the viscoplastic deformation behavior of solder alloys[J]Journal of Electronic Packaging,2001,123(3): 247-253。

[28] Zhang R,Shi H B,Dai Y H,et al。Thermo-mechanical reliability  optimization  of MEMS- based quartz resonator using validated finite element model[J]。Microelectronics Reliability,2012,52(9-10)：2331-2335。

[29] Li X Y,Wang Z S。Thermo-fatigue life evaluation of SnAgCu solder joints inflip chip assemblies[J]Journal of Materials Processing Technology,2007,183(1):6-12。

[30] Hsu H C, Lee H Y, Hsu Y C。 A novel submodeling scheme on thermal cycle test for CMOS Image sensor[C] // International Conference on Electronics Packaging Technology。 Shanghai, China, 2006, 1-5。

[31] Park S B，Dhakal R，Lehman L，et al。 Measurement of deformations in SnAgCu solder

interconnects under in situ thermal loading[J]。 Acta Materialia, 2007, 55: 3253-3260。 [32] Zhang L, Sun L, Guo Y H, et al。 Reliability of lead-free solder joints in CSP device under

thermal cycling[J]。 Journal of Materials Science: Materials in Electronics 2014， 25(3):1209-1213。

[33] Morgan B, Hua X F, Iguchi T, et al。 Substrate interconnect technologies for 3D MEMS packaging[J]。 Microelectronic Engineering, 2005, 81(1): 106-116。

[34] Chang B J, Wang L, Drink J, et al。 Finite element modeling predicts the effects of voids on thermal shock reliability and thermal resistance of power device[J]。 Welding Journal, 2006, 85(5): 63-70。

[35] Park S B, Dhakal R, Lehman L, et al。 Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading[J]。 Acta Materialia, 2007, 55: 3253-3260。

[36] Ha S S, Kim J W, Ha S O, et al。 Shear parameters for brittle fracture of flip chip solder

joint[J]。 Materials Science and Technology, 2011, 27(3): 696-701。